An Affordance‐Based Methodology for Package Design

Chip-Package Co-Design Methodology for Global (PDF)

This paper proposes a global methodology combining electromagnetic (EM) analysis with chip power switching macro-modeling for accurate co-design of re-distribution layers (RDLs). Differences between segregated approach (where Chip, RDL and package are analysed separately and then combined following cascade techniques) and integrated/global approach (where Chip, RDL and package are analysed as o...

R package sae: Methodology

An Integrated Design Methodology for Digital Systems

Today’s digital systems usually consist of interacting hardware and software components of high complexity. Design of such systems requires support of efficient design methodologies and automatic/semiautomatic tools. This paper presents an integrated design methodology and some design tools which have been developed at Linköping University. We introduce the methodology which is based on a unifi...

An evaluation methodology for crowdsourced design

In recent years, the “power of the crowd” has been repeatedly demonstrated and various Internet platforms have been used to support applications of collaborative intelligence in tasks ranging from open innovation to image analysis. However, crowdsourcing applications in the fields of design research and creative innovation have been much slower to emerge. So, although there have been reports of...

An AI-Based Methodology for Factory Design

This article provides a discussion of factory design and an artificial intelligence (AI) approach to this problem. Major issues covered include knowledge acquisition and representation, design methodology, system architecture, and communication The facilities design expert system (FADES) developed by the author is presented and described to illustrate issues in factory design. 72 AI MAGAZINE AI...